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Aluminas, Spherical & Thermally Conductive Fillers, DAM/DAW, ASFP-20

 

Manufactured in Japan by DENKA (DENKI KAGAKU KOGYO K.K.)

S.E.M. Photo

1. Introduction

So far, a crystal silica, AIN and Si3N4 filler, has been supplied against inquiry of the high thermal conductance filler filled in resin and rubber. However, the performance for the chemical stability, flowability and mold abrasion were not enough. A new spherical alumina filler was developed that has high thermal conductance and basic required characteristics as silica filler by utilizing various technological knowledge that improved the silica filler over a long period.

2. Basic characteristics of high thermal conductive filler

2 - 1. DAM Series
This grade is high level spherical alumina filler which is produced by high temperature fusing technology. Products that have several particle size distribution (herein after: P.S.D.) (representative value) are prepared.

2 - 2. DAW Series
This product has drastically reduced alumina peculiar ionic impurity content represented by Na ion through the special processing. Products that have several P.S.D. (representative value) are prepared.

DAM/DAW General Properties
DAM/DAW Series
    70 45 07 05 03
Al2O3 wt.%   >99.8     >99.8     >99.8     >99.8     >99.8  
Specific Surface Area m2/g 0.1 0.2 0.3 0.5 0.7
Mean Particle size µm 70 45 9 5 3
Sieve greater than or equal to75µm % - <0.5 <0.5 <0.5 <0.5
Fe2+/ionic impurity ppm 18.0 15.0 12.0 7.0 5.0
Ionic Impurity DAM
   Electric Conductivity µS/cm 80 45 45 70 70
Na+ ppm 40.0 40.0 155.0 180.0 180.0
Cl- ppm 0.5 0.5 1.0 1.0 1.0
    DAW
Electric Conductivity µS/cm 8 8 8 10 10
Na+ ppm 15.0 6.0 7.5 10.0 10.0
Cl- ppm 0.2 0.2 0.2 0.3 0.3



DAM/DAW particle size

    ASFP-20  
Al2O3 wt% greater than or equal to99.9
Specific surface Area m2/g 12-18
Mean Particle size µm 0.2-0.5
Ionic Impurity  
   Electric Conductivity   µS/cm   50
  Fe2+ ppm 3.0
  Na+ ppm 20.0
  Cl- ppm 0.2


DAB_particle-size

 

 

 


 
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