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Aluminas, Spherical & Thermally Conductive Fillers, DAB

 

Manufactured in Japan by DENKA (DENKI KAGAKU KOGYO K.K.)

S.E.M. Photo
SEM

1. Introduction

So far, a crystal silica, AIN and Si3N4 filler, has been supplied against inquiry of the high thermal conductance filler filled in resin and rubber. However, the performance for the chemical stability, flowability and mold abrasion were not enough. A new spherical alumina filler was developed that has high thermal conductance and basic required characteristics as silica filler by utilizing various technological knowledge that improved the silica filler over a long period.

2. Basic characteristics of high thermal conductive filler

DAB Series
This grade can fill up high filler content into a resin by adding developed super fine powder and making suitable P.S.D. with optimum combination of DAW series based on our spherical silica filler technology. Products that have several P.S.D. (representative value) are prepared.

 

Typical Properties of DAB Series

 

DAB Series

  DAB-10SI DAB-20SA
Content (wt.%) Al2O3 90 95
SiO2 10 5
SSA (m2/g) 2.3 2.2
Diameter Median (µm) 12.5 7.6
EC (µS/cm) 4.6 3.2
PH 6.5 6.8
Wet Sieve % 45 ~ 75 µm 11.7 10.8
75 ~ 150 µm 0.01 0.01
Ionic Impurity* (ppm) Fe: Atomic Absorption 7.5 7.0
Na: Atomic Absorption 4.1 4.1
Cl: Ion Chromatography 0.4 0.5
Water Content (%) 0.18 0.16
Uranium Content (ppb) 6 6

* Extracted Water: Fe = aqua regia, Na/Cl = deionized water

 

 

 

 

*Test Method of Mold Abrasion
Weight loss of Al-Disk with hole after EMC pass through the hole.

  EMC Quantity: 150cm3
Temperature: 175°C
Hole size of Al-Disk: 3mm
EMC with no Hardener

 

 

 

 


 
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